Spec Sheet PDF

Transkript

Spec Sheet PDF
Memory Module Specifications
HX430C15SB2K4/32
32GB (8GB 1G x 64-Bit x 4 pcs.)
DDR4-3000 CL15 288-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
15 cycles
Row Cycle Time (tRCmin)
46.5ns (min.)
Refresh to Active/Refresh
Command Time (tRFCmin)
260ns (min.)
Row Active Time (tRASmin)
33ns (min.)
Maximum Operating Power
TBD W*
UL Rating
94 V - 0
Operating Temperature
0o C to +85o C
Storage Temperature
-55o C to +100o C
*Power will vary depending on the SDRAM used.
DESCRIPTION
FEATURES
HyperX HX430C15SB2K4/32 is a kit of four 1G x 64-bit (8GB)
DDR4-3000 CL15 SDRAM (Synchronous DRAM) 2Rx8, memory
modules, based on sixteen 512M x 8-bit FBGA components per
module. Total kit capacity is 32GB. Each module supports
Intel® XMP (Extreme Memory Profiles). Each module has
been tested to run at DDR4-3000 at a low latency timing of
15-17-17 at 1.35V. The SPDs are programmed to JEDEC
standard latency DDR4-2133 timing of 15-15-15 at 1.2V.
Each 288-pin DIMM uses gold contact fingers. The JEDEC
standard electrical and mechanical specifications are as
follows:
• Power Supply: VDD = 1.2V Typical
XMP TIMING PARAMETERS
•JEDEC: DDR4-2133 CL15-15-15 @1.2V
•XMP Profile #1: DDR4-3000 CL15-17-17 @1.35V
•XMP Profile #2: DDR4-2666 CL14-15-15 @1.35V
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.25V to 3.6V
• On-Die termination (ODT)
• 16 internal banks; 4 groups of 4 banks each
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Height 1.36” (34.57mm)
Continued >>
hyperxgaming.com
Document No. 4807559-001.A00
12/22/15
Page 1
continued
MODULE WITH HEAT SPREADER
MODULE DIMENSIONS
133.35
129.55
31.25
2.10±
±0.15
Pin 1
Detail A
3.35
Detail B
Pin 35
Pin 47
Detail D
Detail E
64.60
28.90
14.60
17.60
8.00
11.00
2.70±0.15
3.00
Detail C
Pin 105
Pin 117
56.10
22.95
FOR MORE INFORMATION, GO TO HYPERXGAMING.COM
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
HyperX is a division of Kingston.
©2015 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA.
All rights reserved. All trademarks and registered trademarks are the property of their respective owners.
Document No. 4807559-001.A00
Page 2
hyperxgaming.com

Podobné dokumenty

Datasheet PDF

Datasheet PDF ©2015 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved. All trademarks and registered trademarks are the property of their respective owners.

Více

Spec Sheet PDF

Spec Sheet PDF ©2015 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved. All trademarks and registered trademarks are the property of their respective owners.

Více

Spec Sheet PDF

Spec Sheet PDF DDR3-2133 CL11 240-Pin DIMM Kit

Více

HX313C9F/4

HX313C9F/4 eight 512M x 8-bit DDR3 FBGA components. This module has been tested to run at DDR3-1333 at latency timing 9-9-9 at 1.5V. The JEDEC standard electrical and mechanical specifications are as follows:

Více

HX316C10FRK2/8

HX316C10FRK2/8 the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows:

Více

Spec Sheet PDF

Spec Sheet PDF x 72-bit (4GB) DDR4-2133 CL15 SDRAM (Synchronous DRAM), 1Rx8, ECC, memory module, based on nine 512M x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2133 timing of 15-...

Více

KVR16LR11D4K3/48

KVR16LR11D4K3/48 Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

Více